Technology that Enables

One platform. Many applications.

From the outset, our core technology platform was developed to facilitate the volume manufacture of highly integrated optical/electronic devices. Rockley’s multi-micron waveguide platform offers fundamental benefits over conventional solutions. These advantages include higher density waveguide circuits, better manufacturing tolerances, superior optical power handling, and a more efficient interface to the photonics IC. These elements allow us to increase performance and efficiency, while at the same time, reducing size, power usage, and ultimately cost.

This unique and differentiated platform with Silicon Photonics at its core, is well positioned to make photonics as pervasive as microelectronics.

Photonic Integrated Circuits in Silicon with Integrated III-V

Electronic Integrated Circuits (ASICs)

Sensing Algorithms

The Full Stack
Rockley Platform

Photonic & Electronic Co-Packaging

Firmware / Software

System Architecture & Hardware Design

Photonic Integrated Circuits in Silicon with Integrated III-V

Electronic Integrated Circuits (ASICs)

Sensing Algorithms

The Full Stack
Rockley Platform

Photonic & Electronic Co-Packaging

Firmware / Software

System Architecture & Hardware Design

Key Advantages

Architecture for many applications

In developing the platform architecture, we leveraged our extensive experience in applying photonics to many different applications. The underlying flexibility of the platform allows us to easily configure core building blocks to produce a wide range of functional components and modules.

Fabless with manufacturing process ownership

We continue to invest in proprietary process development, subsequently transferring these new capabilities to our production fab partner network.

Highly differentiated process

The Rockley process is unique (based on multi-micron thick SOI) and is not commercially available as a standard foundry offering.

Optimized for photonics

Our process is not derived from any CMOS node. While it uses standard semiconductor manufacturing equipment, the process has been optimized for photonics performance while incorporating novel features to allow for easier integration and packaging.

High barrier to entry

Our know-how is based on 30+ years of sequential leadership in the development and commercialization of Silicon Photonics. Rockley has built a truly solid foundation of deep technology and unmatched high-volume product delivery capabilities that are not easily replicated.

Deeply committed partners

Our high-volume foundry network are truly our partners, sharing our growth vision, and working side-by-side with the Rockley team to push the boundaries of photonic component manufacturing.

Architecture for many applications

In developing the platform architecture, we leveraged our extensive experience in applying photonics to many different applications. The underlying flexibility of the platform allows us to easily configure core building blocks to produce a wide range of functional components and modules.

Fabless with manufacturing process ownership

We continue to invest in proprietary process development, subsequently transferring these new capabilities to our production fab partner network.

Highly differentiated process

The Rockley process is unique (based on multi-m thick SOI) and is not commercially available as a standard foundry offering.

Optimized for photonics

Our process is not derived from any CMOS node. While it uses standard semiconductor manufacturing equipment, the process has been optimized for photonics performance while incorporating novel features to allow for easier integration and packaging.

High barrier to entry

Our know-how is based on 30+ years of sequential leadership in the development and commercialization of Silicon Photonics. Rockley has built a truly solid foundation of deep technology and unmatched high-volume product delivery capabilities that are not easily replicated.

Deeply committed partners

Our high-volume foundry network are truly our partners, sharing our growth vision, and working side-by-side with the Rockley team to push the boundaries of photonic component manufacturing.

 

Toolbox Elements

Lasers

Rockley lasers offer fine wavelength control and good power efficiency. The waveguide platform allows efficient wafer-scale integration of laser-devices through a flip-chip process.

Modulators & Detectors

Rockley has developed optical modulators and detectors that are ultra-compact, power efficient and high speed, capable of handling high data rates and a broad range of wavelengths.

Combiners & Splitters

The Rockley platform is capable of wavelength division multiplexing (WDM) and demultiplexing, enabling in excess of 16 wavelengths on a single optical path.

Fiber Optic Coupling

The photonic IC contains on-chip embedded interfaces to the optical fibers. These interfaces allow the fiber to be attached directly to the photonic IC without external light coupling elements.

Free-Space Optics

The Rockley platform allows for efficient light coupling from free space into and out of the photonics circuits, with either edge or perpendicular coupling. This feature enables a broad range of consumer-sensing applications.

Photonic Integrated Circuits

The Rockley development platform enables integration of light sources, active devices, passive devices and optical coupling elements into a single silicon device.

Wafer-Scale Processing

The silicon photonics platform enables high throughput wafer-scale processing of monolithic and multi-die structures including options for chip-on-wafer integration.

Interface Electronics

The Rockley optoASIC includes custom analog circuitry to translate high-speed datastreams into signals that actuate the photonics ICs (drivers) and receive signals from them (amplifiers).

Rockley Packaged Assembly

Packaged Assembly

The assembly of electrical ASICs, photonics ICs and fiber optics into a single, highly-integrated product requires a test and manufacturing flow which enable high volume scale.

 

Manufacturing Ecosystem Ready to Scale
 

Fabless model: global partnerships with multiple Tier-1 Foundries
 

Running proprietary process wholly-owned by Rockley and protected by IP

High-Volume IC / Wafer Foundry

Silicon photonic integrated circuits and wafer scale integration

  • Auto, consumer, & health qualified
  • 400K+ wafers per year capacity

High-Volume III-V Semiconductor Foundry

III-V semiconductor active optics

  • Telecom & consumer qualified
  • Large wafer scale, fully automated

Leading Global IC Foundry

Electronic integrated circuits

  • Used by most major consumer OEMs
  • Qualified ultra high-volume process node