Technology that Enables
One platform. Many applications.
From the outset, our core technology platform was developed to facilitate the volume manufacture of highly integrated optical/electronic devices. Rockley’s multi-micron waveguide platform offers fundamental benefits over conventional solutions. These advantages include higher density waveguide circuits, better manufacturing tolerances, superior optical power handling, and a more efficient interface to the photonics IC. These elements allow us to increase performance and efficiency, while at the same time, reducing size, power usage, and ultimately cost.
This unique and differentiated platform with Silicon Photonics at its core, is well positioned to make photonics as pervasive as microelectronics.
Photonic Integrated Circuits in Silicon with Integrated III-V
Electronic Integrated Circuits (ASICs)
Sensing Algorithms,
AI & Cloud
Analytics
The Full Stack
Rockley Platform
Photonic & Electronic Co-Packaging
Firmware / Software
System Architecture & Hardware Design
Photonic Integrated Circuits in Silicon with Integrated III-V
Electronic Integrated Circuits (ASICs)
Sensing Algorithms,
AI & Cloud
Analytics
The Full Stack
Rockley Platform
Photonic & Electronic Co-Packaging
Firmware / Software
System Architecture & Hardware Design
Key Advantages
Architecture for many applications
In developing the platform architecture, we leveraged our extensive experience in applying photonics to many different applications. The underlying flexibility of the platform allows us to easily configure core building blocks to produce a wide range of functional components and modules.
Fabless with manufacturing process ownership
We continue to invest in proprietary process development, subsequently transferring these new capabilities to our production fab partner network.
Highly differentiated process
The Rockley process is unique (based on multi-micron thick SOI) and is not commercially available as a standard foundry offering.
Optimized for photonics
Our process is not derived from any CMOS node. While it uses standard semiconductor manufacturing equipment, the process has been optimized for photonics performance while incorporating novel features to allow for easier integration and packaging.
High barrier to entry
Our know-how is based on 30+ years of sequential leadership in the development and commercialization of Silicon Photonics. Rockley has built a truly solid foundation of deep technology and unmatched high-volume product delivery capabilities that are not easily replicated.
Deeply committed partners
The companies in our high-volume foundry network are truly our partners, sharing our growth vision, and working side-by-side with the Rockley team to push the boundaries of photonic component manufacturing.
Architecture for many applications
In developing the platform architecture, we leveraged our extensive experience in applying photonics to many different applications. The underlying flexibility of the platform allows us to easily configure core building blocks to produce a wide range of functional components and modules.
Fabless with manufacturing process ownership
We continue to invest in proprietary process development, subsequently transferring these new capabilities to our production fab partner network.
Highly differentiated process
The Rockley process is unique (based on multi-m thick SOI) and is not commercially available as a standard foundry offering.
Optimized for photonics
Our process is not derived from any CMOS node. While it uses standard semiconductor manufacturing equipment, the process has been optimized for photonics performance while incorporating novel features to allow for easier integration and packaging.
High barrier to entry
Our know-how is based on 30+ years of sequential leadership in the development and commercialization of Silicon Photonics. Rockley has built a truly solid foundation of deep technology and unmatched high-volume product delivery capabilities that are not easily replicated.
Deeply committed partners
The companies in our high-volume foundry network are truly our partners, sharing our growth vision, and working side-by-side with the Rockley team to push the boundaries of photonic component manufacturing.
Toolbox Elements
Lasers
Rockley lasers offer fine wavelength control and good power efficiency. The waveguide platform allows efficient wafer-scale integration of laser-devices through a flip-chip process.
Modulators & Detectors
Rockley has developed optical modulators and detectors that are ultra-compact, power efficient and high speed, capable of handling high data rates and a broad range of wavelengths.
Combiners & Splitters
The Rockley platform is capable of wavelength division multiplexing (WDM) and demultiplexing, enabling in excess of 16 wavelengths on a single optical path.
Fiber Optic Coupling
The photonic IC contains on-chip embedded interfaces to the optical fibers. These interfaces allow the fiber to be attached directly to the photonic IC without external light coupling elements.
Free-Space Optics
The Rockley platform allows for efficient light coupling from free space into and out of the photonics circuits, with either edge or perpendicular coupling. This feature enables a broad range of consumer-sensing applications.
Photonic Integrated Circuits
The Rockley development platform enables integration of light sources, active devices, passive devices and optical coupling elements into a single silicon device.
Wafer-Scale Processing
The silicon photonics platform enables high throughput wafer-scale processing of monolithic and multi-die structures including options for chip-on-wafer integration.
Interface Electronics
The Rockley optoASIC includes custom analog circuitry to translate high-speed datastreams into signals that actuate the photonics ICs (drivers) and receive signals from them (amplifiers).
Packaged Assembly
The assembly of electrical ASICs, photonics ICs and fiber optics into a single, highly-integrated product requires a test and manufacturing flow which enable high volume scale.
AI & Cloud Analytics
Rockley’s cloud platform leverages the power of large datasets from our unique sensor solutions to discover and provide actionable insights to consumers and healthcare partners.
Manufacturing Ecosystem Ready to Scale
Fabless model: global partnerships with multiple Tier-1 Foundries
Running proprietary process wholly-owned by Rockley and protected by IP
High-Volume IC / Wafer Foundry
Silicon photonic integrated circuits and wafer scale integration
- Auto, consumer, & health qualified
- 400K+ wafers per year capacity
High-Volume III-V Semiconductor Foundry
III-V semiconductor active optics
- Telecom & consumer qualified
- Large wafer scale, fully automated
Leading Global IC Foundry
Electronic integrated circuits
- Used by most major consumer OEMs
- Qualified ultra high-volume process node
