Rockley technology empowers ASIC designers to bring fiber-optic links directly into the package for their next-generation designs. With a unique integration architecture focused on volume manufacturability plus photonics technology that emphasizes low power and cost efficiency, Rockley is paving the way for the next generation of high-speed interfaces.

With its highly customizable technology platform, Rockley’s photonics architecture enables a wide range of products for sensing applications that require a free-space optical interface, making it ideal for high-volume market applications.

By integrating optical Transmit, Receive, Scanner, and analog-front-end blocks into a single architecture, the Rockley platform delivers a unique, high-performance solution for multiple machine vision applications, including LiDAR for the next generation of autonomous vehicles.

Rockley Photonics chipsets enhance the capabilities of both advanced interconnect applications and industry-standard pluggable transceiver modules, and our chipset solutions and reference designs empower our partners to maximize the efficiency of their optical connectivity products.