Data Analysis and Process Integration Engineer

This role is responsible for monitoring, improving, recording, organizing, tracking and presenting the process data of RP fab partners. It is also responsible for early addressing process integration challenges and quality control. It requires close cooperation with the partner teams as well as RP process, design, measurement, and packaging teams. 

Responsibilities:

  • Analyze fab data to identify, participate in and/or lead high impact process control and process integration activities that result in improvements to safety, quality, delivery, cost, including production yield at fab partners in collaboration with RP and partner teams. 
  • Be responsible for incoming and outgoing quality inspections at all partner interfaces. This includes preparation of CoC templates and checking their completion and correctness, and recording them for future reference. It also includes recording, per batch, all quality issues and impact on yield to provide final wafer map to our internal customers. It also includes responsibility for monitoring yield data procedures and outcome at fab partners. 
  • Provide advanced trouble-shooting support to fab partners and RP teams, also considering turn-around time.  This includes supporting short loop planning to early assessment of process integration challenges and yield issues, in collaboration with RP packaging and design teams, as well as logistic of production lots and information exchange among all fabs.
  • Conduct batch record reviews, communicate the plan to fab partners and discuss with their experts, highlighting process integration challenges, assess deviations from plan/expectations and verify the conformance to specifications, and provide final certificate of compliance within RP as well as within fab partners.
  • Own quality cases related to process integration and/or yield improvements and drive the team at RP and/or partners as needed to find root cause, contain impact, and sustain solved outcome. Be responsible for monitoring the implementation of the containment action and related yield data procedures and outcome at fab partners. This includes ensuring that process control systems and measurement databases are highly available and error resistant, and support filling-in the gaps as needed.
  • Track schedule, cost, risk assessment, and yield of the improvement activities within all fab partners. It includes materials, utilities, and labor. It also includes risk assessment related to process integration and/or process transfer to new fab. 
  • Be the interface for production mask ordering, scheduling, floorplanning, and layout activities which take place at RP and fab partners. 
  • Support the development and standardization of in-line measurement plans for process monitoring. It includes training of RP team on yield improvement activities, getting their feedback for process improvements, and statistical data control.
  • Review operating conditions for variations and recommend corrective actions. It includes developing, implementing and communicating best practices between fab partners, suppliers, and RP teams. It also includes to implementing checklists, guidelines, "lesson learnt" and history documents to capture and record all yield-improvement activities. 
  • Work closely with internal and external process teams to understand requirements and identify improvement opportunities; translate into project or minor enhancement specifications, complete with work estimates and forecasted benefits

Requirements:

  • 3+ years experience with engineering yield or quality trouble-shooting for semiconductor processing
  • 2+ year experience in manufacturing fabs for photonics applications
  • Process transfer experience is ideal
  • Track record of dealing with multiple fab partners, problem solving, and yield improvement
  • Clean room hands-on experience in semiconductor environment preferred 

Educational Requirements:

  • BSc Preferred in related fields

Email your resume to careers@rockleyphotonics.com and reference RP1067.

All candidates must be able to meet and work under Export Control requirements.

 

Director of Sales

The Director of Sales reports to the Chief Commercial Officer and is responsible for customer-focused revenue-generating activities including relationship development, identifying and tracking opportunities, developing account strategies, driving opportunities to closure, and forecasting revenue on an ongoing basis. This individual will play a key role in realizing the Rockley Photonics vision for high-density, low-power, economical optical communications through tight integration with digital electronics.  The Director of Sales is responsible for account strategy as well as the engagement tactics for new opportunities, and owns the revenue forecast for committed customer designs. As the business grows, the Director of Sales will be responsible for growing the account team and providing direction, mentorship and leadership to sales managers in North America and abroad.

Major Responsibilities

  • Identify and actively track prospective customer accounts and maintain relationships with key decision makers at those accounts
  • Study and train on Rockley Photonics technology. Present core product advantages to the customer and identify the right Rockley products to serve customer needs. 
  • Source, track, and actively manage near-term and medium-term revenue opportunities in new customer development projects. 
  • For active accounts, chart and manage account strategies including upcoming programs, key decision makers and a plan to maintain contact with decision makers over the duration of active opportunities. 
  • Identify technical assistance required to support active design opportunities and work with Rockley management to assign personnel to support pre-sales activities.   
  • Negotiate pricing and deal terms, working from product-based pricing strategy and guidelines established by Product Management. 
  • Drive and close design wins.  
  • Maintain customer-specific forecasts and actively manage orders to support near-term (2 quarter) company shipments and revenues. 
  • Maintain forecast for medium-term (6 quarter) customer demand. Work with customer to keep forecasts updated and work with company operations to align on long-term build-plans. 
  • Actively manage customer expectations for product delivery quantities and schedule.  
  • Track active designs (post-win) and identify additional technical support required to ensure customer success on their designs. Work with Rockley management to appropriately staff customer support functions. 
  • Prepare and manage quarterly targets for new design wins and revenue, individually and for the team. 
  • Work with the product management and marketing teams to define product and platform strategies
  • Periodically contribute to revised company business plan and support investor DD.
  • Recruit, train, and manage new account managers and pre-sales engineers as required to support the growth of the business. 

Knowledge, Skills and Abilities

The Director of Sales will play a key role in driving the Rockley Photonics vision for high-density, low-power, economical optical communications through tight integration with digital electronics. In particular, this individual is responsible for identifying customer needs and matching them with Rockley product solutions.

Success in this role requires a passion for identifying solutions to customer problems, communicating the value and advantages of our advanced new technology, negotiating commercial terms for mutual success, and relentlessly driving opportunities to closure. Equally important is a day-to-day focus on customer relationship development, ongoing support of committed customers, and active management of both near-term product revenue as well as new revenue opportunities. Because the customer applications are  highly complex and multidisciplinary, success in the role requires enthusiasm for new technology and comfort in working with a technically expansive set of customer decision makers.

The Director of Sales’ responsibilities are expected to expand increasingly into a supervisory/managerial role as the business grows. It is critical for this individual to work effectively in both an individual capacity and as a supervisor of a team.

Educational & Experience

Requires a minimum of 10 years of experience in direct sales of communications systems, semiconductors, or optical components, including direct responsibility for design win closure (sales quota) and customer shipments/revenues (demand forecasting). Also requires at least 3 years of technical experience in product development, customer support engineering, field sales engineering, or operations engineering. A BS degree in a technical discipline is strongly preferred.

The candidate must have demonstrated success in establishing business at new accounts: either at all-new customers or within new divisions at existing customers. A strong background in managing complex accounts at large customers with highly-technical decision makers is key. Seeking a highly motivated individual, persistent, resilient, pro-active, a quick learner, with a strong work ethic and a customer-focused mindset. Experience in making executive-level presentations and communicating with investors is highly desired.

Email your resume to careers@rockleyphotonics.com and reference RP1095.

All candidates must be able to meet and work under Export Control requirements.

 

Electronics Technician

The Electronics Technician will work closely with the Rockley Photonics engineering team, and will be responsible for electronic assemblies and tests.  The successful candidate will be skilled in soldering, PCBA rework, and building assemblies. The person in this position must be self-motivated, have strong communication skills and a growth mindset. This position reports to the Director of Product Development.

Responsibilities:

*This list is not all inclusive. Additional duties will be assigned as needed.

  •  Assist Engineers in building and reworking PCBAs;
  • Assist Engineers in building mechanical assemblies and test assemblies, cable harnesses, optical fiber handling and splicing;
  • Kitting and placing PR for PCBA BOM, Assembly BOMs;
  • Assist Engineers in running PCBA and module level electrical, thermal, mechanical, optical and reliability testing;
  • Maintain and manage equipment in lab.

Requirements:

  • Skilled in soldering, PCBA rework, and building assemblies (mechanical, FW loading, …) Familiar with many packaging assembly and test equipment.
  • Ability to read schematics and assembly drawings.
  • Familiar with many electronic test equipment.
  • Familiar with working and handling fiberoptic components; experience with fiber splicing is a plus.
  • Experienced in kitting PCBAs.

Educational Requirements:

  • High School diploma required. Associate’s degree is a plus.
  • Minimum 5 years as an electronics technician in a product development environment.

Other Skills/Experience:

  • Ability to work with engineers from varying disciplines.
  • Must have the ability to work independently as well as contribute to a team effort.
  • Hand-eye coordination with meticulous attention to detail.
  • Strong oral communication skills.
  • Basic computer skills, experience with MS Office.
  • Competencies for Role: Positive Attitude, Efficient, Flexibility/Adaptability, Organized, Strong Communication Skills
  • Organizational Competencies: Team Work, Persistence/Resilience, Pro-Active, Quick Learner, Growth Mindset

Email your resume to careers@rockleyphotonics.com and reference RP1134.

All candidates must be able to meet and work under Export Control requirements.

 

Laser Design Engineer

As a Laser design engineer at Rockley Photonics, you will own the design and characterization of lasers for a variety of different applications and market segments.  You will work with design, process and test engineers to characterize the laser and drive improvements in performance and identify root cause for device performance. You will work with senior engineers to correlate device performance to simulations.

Responsibilities:

  • Design and develop to product readiness low power, compact silicon photonics lasers
  • Work closely with test engineers and technicians to characterize laser designs vs specifications and document test flows
  • Interface closely with thermal and HS designers to optimize design for x-temp performance for various form factors
  • Lead design-process debug activities by interfacing with process engineers and provide feedback to next run
  • Work closely with system engineers to quantify the impact on the laser and vice-versa

Requirements:

  • 2 years of experience in laser design in a product setting
  • Strong background in fundamentals of lasers
  • Strong experience in the characterization of lasers to extract fundamental parameters
  • Good knowledge and understanding of with different laser types & trade offs

Educational Requirements:

  • MS in electrical engineering with laser background, PhD preferred, recent college graduates welcome

Email your resume to careers@rockleyphotonics.com and reference RP1022.

All candidates must be able to meet and work under Export Control requirements.

 

Microelectronic Packaging Engineer

The Microelectronic Packaging Engineer will report to the Manager of Packaging Engineering and will design and develop packaging solutions for the ASIC Rockley Photonics' Silicon Photonics platform.  This role requires strong teamwork with the Silicon Photonic and ASIC design teams as well as the Photonic Packaging engineer.

Responsibilities:

*This list is not all inclusive. Additional duties will be assigned as needed.

  • Investigate and recommend the optimum flip-chip bonding processes for Rockley's ASIC/photonic package;
  • Identify and manage partners in the design and manufacturing of ASIC packaging;
  • Analyze thermal and mechanical stresses in Rockley’s package designs and evaluate the reliability and functionality;
  • Design and layout of flip-chip package substrates;
  • Design prototype packages and short-loop test structures to quickly evaluate the feasibility of the approach, and incorporate that learning into the design;
  • Coordinate with suppliers, process engineers and contract manufacturers to define the process flow and ensure manufacturability of the design;
  • Manage prototype builds:  Create bill of materials, identify suppliers, plan and manage the build schedule;
  • Perform mechanical, thermal and electrical measurements to prove the performance of the components and assembly;
  • Track early production results and drive improvements in the design and process.

Requirements:

  • Design and reliability of flip-chip packages;
  • Simulation and analysis of thermal and mechanical stresses;
  • Successful design and transfer to manufacturing of IC packages a strong plus;
  • Design for signal integrity and power integrity a plus;
  • Experience with thermo-compression flip chip design and processing a plus
  • Values for role: Focused, Good visualization, Follow-through
  • Company values: Self-driven, Positive, Innovative
  • Successful Competencies include: Integrity, Intelligence, Persistence, Organization, Efficiency, Pro-active, Attention to details, Commitment to success

Educational Requirements:

  • MSc or PhD in related field, or BSc and 5+ years of experience

Email your resume to careers@rockleyphotonics.com and reference RP1131R.

All candidates must be able to meet and work under Export Control requirements.

 

Packaging Technician

The Packaging Technician will work closely with the Rockley Photonics engineering team, and will be responsible for packaging assemblies and tests.  The successful candidate will have experience in epoxying and soldering, building assemblies, optical alignment (fibers), kitting assemblies and handling small components. The person in this position must be self-motivated, have strong communication skills and a growth mindset. This position reports to the Manager of Packaging Engineering.

Responsibilities:

*This list is not all inclusive. Additional duties will be assigned as needed.

  • Work with process engineers to develop innovative and cost-effective manufacturing processes;
  • Assemble and test engineering prototypes;
  • Order materials for prototype builds and track inventory;
  • Work with design engineers to perform component level electrical, thermal, mechanical, optical and reliability testing;
  • Work with process engineers to document assembly processes;
  • Support new product introduction and train production operators;
  • Maintain and manage equipment in lab.

Requirements:

  • Skilled in epoxying and soldering, building assemblies, optical alignment (fibers), handling small components.
  • Familiar with many packaging assembly and test equipment.
  • Experienced in kitting assemblies, placing PR for components.

Educational Requirements:

  • High School diploma required. Associate’s degree is a plus.
  • Minimum 5 years as a packaging technician in product development environment.

Other Skills/Experience:

  • Ability to work with engineers from varying disciplines.
  • Must have the ability to work independently as well as contribute to a team effort.
  • Hand-eye coordination with meticulous attention to detail.
  • Strong oral communication skills.
  • Basic computer skills, experience with MS Office.
  • Competencies for Role: Positive Attitude, Efficient, Flexibility/Adaptability, Organized, Strong Communication Skills
  • Organizational Competencies: Team Work, Persistence/Resilience, Pro-Active, Quick Learner, Growth Mindset

Email your resume to careers@rockleyphotonics.com and reference RP1133.

All candidates must be able to meet and work under Export Control requirements.

 

Photonic Test Engineer

This role is responsible for executing on development of world class test infrastructure for silicon photonics required to intercept the product development timelines of Rockley Photonics.

Responsibilities:

  • Test and characterization of passive and active photonic devices such as waveguides, light couplers, optical modulators and photo-detectors
  • Develop automation required to stress and continuously monitor parts through the test
  • Work with software team to upload data to the right databases with appropriate tags to allow correlations to design and process information
  • Close interaction with design and process teams to perform failure analysis and debug failed devices
  • Develop automated testing for die level testing of SiPh chips, and laser chips pre and post bonding/packaging
  • Lead documentation of the development activity
  • Report out scheduling and WIP monitoring of activities and cells under stress
  • Perform initial failure analysis including but not limited to failed device electrical and optical characterization and coordinate physical debug at vendor site

Requirements:

  • 5+ years of experience in Si Photonic testing at die, wafer level and requirements
  • Experience with test automation for die level testing of photonic devices
  • Experience with Si Photonics device testing and characterization
  • Background in vendor interaction and drive projects to completion at remote locations

Educational Requirements:

  • BS in related field

Email your resume to careers@rockleyphotonics.com and reference RP1104.

All candidates must be able to meet and work under Export Control requirements.

 

Process Engineer

This role is responsible to develop the process for all the devices within our Si Photonic platform and their integration. It operates in second shift hours with the goal to improve manufacturing, processing, metrology and development cycle time. 

Responsibilities:

  • Support process development and coordination of related activities for RP devices. This includes waveguides, features for passive alignment, and corresponding metrology, data analysis, and new features as required. 
  • Prepare and update process flow documentation, including split plans, instructions, and module description with "frozen process" when available or for IP purposes. It includes gathering, analyzing and summarizing process data, preparing reports describing the performed work, goals and outcome, and including recommendations for next steps or future plans and integration. 
  • Check process tolerances and limitation for critical steps, share and discuss them with operators, and suggest plans and schedule for improvements; it includes providing, testing, and updating related design rules, measurement plan, and cpk evaluation with baseline yield targets, working in close cooperation with the designers.
  • Suggest and implement error-proofing and process control monitor structures, measurement procedures, analysis tools for critical parameters to develop or monitor a process.
  • Provide feedback on mask layout, in close cooperation with layout engineers and designers, being responsible for ordering, organizing incoming inspection, and provide schedule
  • Support production-like procedures and lean thinking, particularly to improve quality control and lead time. This can include work in the clean room and closely with the operators to understand tool capabilities, processing schedule, bottleneck risk, and provide inputs for improving lead time or providing back up solutions.
  • Support quality clinic cases and implement corrective actions; monitor and track yield issues and investigate root cause and suggest corrective actions. 
  • Be responsible for organizing data of the owned batches and prepare technical summary and reports to share with wider team. 
  • Develop incoming/outgoing inspection procedures, with operators if necessary. 
  • Check tool availability and forecast impact on schedule, trying to minimize impact; discuss with tool-owner counterpart possible alternative. Check for back-up suppliers or outsourcing solutions.  

Requirements:

  • 5+ years experience in process development and/or process integration, ideally with photonics or MEMS
  • Hands-on experience in clean room semiconductor processes and related metrology and analysis
  • Experience in data analysis

Educational Requirements:

  • BSc Preferred in related fields

Email your resume to careers@rockleyphotonics.com and reference RP1123

All candidates must be able to meet and work under Export Control requirements.

 

Senior Fiber Optic Transceiver Engineer

The Sr. Fiber Optic Transceiver Engineer will report to the Director of Product Development and will be responsible for leading and executing the electrical design and testing of fiber optic transceivers. This position will be responsible for working with other disciplines such as mechanical and thermal engineers, packaging engineers, firmware engineers, chip and component engineers, and layout engineers.The Sr. Fiber Optic Transceiver Engineer will report to the Director of Product Development and will be responsible for leading and executing the electrical design and testing of fiber optic transceivers. This position will be responsible for working with other disciplines such as mechanical and thermal engineers, packaging engineers, firmware engineers, chip and component engineers, and layout engineers.

Major Responsibilities:

*This list is not all inclusive. Additional duties will be assigned as needed.

  • Deliver electrical and RF design of transceiver modules
  • Plan and perform DVT on transceiver prototypes
  • Lead transferring transceiver designs manufacturing
  • Work closely with FW, mechanical and packaging team in delivering transceiver designs
  • Support concept design on future products

 

Requirements:

  • Minimum of 7 years in fiber optic transceiver design and test;
  • Proficient in all aspects of electrical and fiberoptic design of transceivers;
  • Proficient in all aspects of testing and qualification of transceivers;
  • Hands-on lab experience;
  • Ability to work with other disciplines such as mechanical and thermal engineers, packaging engineer, firmware engineers, chip and component engineers, and layout engineers;
  • Ability to take completed transceiver design and transfer to manufacturing;
  • Ability to work with 3rd party contractors;
  • Strong written and oral communication skills;
  • Company Values: Team Work, Persistence, Resilience, Pro-Active, Quick Learner, Growth Mindset;
  • Values for Role: Attention to Detail, Efficient, Good Judgement/Sense of Priority, Calm under pressure, Good Communication/Presentation skills.

Educational Requirements:

  • BS, MS or higher preferred in EE or relevant field

Email your resume to careers@rockleyphotonics.com and reference RP1107.

All candidates must be able to meet and work under Export Control requirements.

 

Senior Photonic High Speed Design Engineer

As a Senior Photonic High Speed Design Engineer at Rockley Photonics, you will own the design of ultra low power, high speed silicon photonics devices from concept phase, technology development through product readiness.  You will lead cross functional teams to identify root cause for device performance and correlate to simulations. You will define the roadmap for the high speed device design in alignment with industry trends.

Responsibilities:

  • Design and develop to product readiness low power, compact silicon photonics modulators and detectors
  • Lead the definition of high speed photonics device architecture for next generation applications
  • Work closely with analog CMOS design to optimize design of modulator driver and receivers
  • Interface closely with thermal and laser designers to optimize design for x-temp performance for various form factors
  • Lead design-process debug activities by interfacing with process engineers and provide feedback to next run
  • Collaboratively define RP strategy for high speed devices for various market segments
  • Provide leadership in the area of high speed photonics by identifying industry trends and aligning Rockley strategy

Requirements:

  • 5+ years demonstrated industry experience in designing HS devices for product
  • Solid experience in co-design of high speed photonics and electronics
  • Strong background with process integration and support

Educational Requirements:

  • MS or PhD in Electrical Engineering

Email your resume to careers@rockleyphotonics.com and reference RP1016R.

All candidates must be able to meet and work under Export Control requirements.

 

Senior Photonic Design Engineer

This role is responsible for design and implementation of advanced Si photonics devices, systems and platform development required to intercept the product development timelines of Rockley Photonics. The role involves designing the state-of-the-art passive and active photonic devices as well as complex integrated photonic systems. The Sr. Design Engineer will work with other members of the fabrication, layout and product development teams.

Responsibilities:

  • Design and implementation of complex integrated Si photonic systems
  • Design and implementation of advanced Si photonic passive devices such as light couplers, MZ interferometer, MUXs/DEMUXs, and filters
  • Design and implementation of active devices including integrated Si photonic phase and amplitude adjusters, and photo-detectors  
  • Support product development and process fabrication teams with related passive, active, and system designs
  • Assist process development team with the initiation and development of a PDK for Rockley Photonics' silicon photonics platform
  • Work and deliver designs under tight tape-out schedules
  • Support CMOS team with providing required models for CMOS-photonic interface
  • Support packaging team with providing required design data for mechanical stress, thermal modeling

Requirements:

  • 2+ years of experience in Si Photonic device and integrated system level designs
  • Excellent experience in photonic modeling tools, electro-optical device modeling, integrated photonic system modeling
  • Excellent experience in Matlab, MS, Excel and computer programming

Educational Requirements:

  • PhD in Engineering or Physics

Other Skills/Experience:

Email your resume to careers@rockleyphotonics.com and reference RP1103.

All candidates must be able to meet and work under Export Control requirements.

 

Senior Photonic Test Engineer

As a Senior Photonic Test Engineer at Rockley Photonics, you will own the test, characterization and validation of high speed optical devices for next generation nodes in the data center.  You will work closely with design and process engineers and implement state of the art testing procedures for silicon photonic devices in order to enable timely launch of products into the marketplace.

Responsibilities:

  • Design and document test flows from wafer level to KGD generation and to align with product roadmap
  • Characterization of high speed photonic devices and passive structures and generate comprehensive test reports and documentation
  • Define measurement of high data rate electro optical links to guarantee compliane to industry standards and specs
  • Interface with test automation engineers and technicians to define improvements in test execution
  • Lead design-process debug activities by interfacing with design and process engineers and provide feedback to next run
  • Lead and define setting up demos for trade shows required
  • Scope out & procure required measurement equipment required for all aspects of test and automation

Requirements:

  • Strong analytics background to tease out trends from large data sets to accelerate TPT
  • Experience with validation of high speed optical components for products
  • Knowledge of fundamental physics of high speed electro-optical devices

Educational Requirements:

  • MS or PhD in Electrical Engineering

Email your resume to careers@rockleyphotonics.com and reference RP1106.

All candidates must be able to meet and work under Export Control requirements.

 

Senior Program Manager

This role is responsible for driving, following up and managing the Rockley Photonics emerging technology Program(s) Plans, resources and schedules.

Responsibilities:

  • Work with Integration Leads and teams to effectively progress the product design/cost/schedule targets
  • Create program plan (activities, schedule, cost, resources, partners) while working with Integration Leads and teams to define major milestones
    • Ability to understand big ticket items in optical design
    • Understand design process dependencies between all functional areas
    • Agile mindset: Ability to highlight alternatives in case of unexpected hurdles in the design process
    • Resourceful: Well connected withing optical industry, established contacts to major suppliers and OEMs
  • Develop product design flow together with Integration Lead and teams
  • Responsible for tracking the overall schedule while maintaining the tops-down and bottoms-up views.
    • Facilitate scheduling conflicts resolution with Integration Leads and escalate to management when appropriate
    • Maintain schedule alignment and dependencies across all the related projects
    • Anticipate possible shortages based on project risks
  • Responsible for tracking the emerging technology resource planning
    • Anticipate, highlight and track gaps between available and planned resources
    • Working with Integration Leads and HR to drive closure of hiring plan
    • Assessing impact of shortages and redirection of resources on program plan
  • Responsible for tracking the overall cost and tracking the development budgets, product costs
    • Identify synergies between projects
    • Make or buy analyses
  • Prepare status reports for Integration Leads
    • Plan vs. current status
    • 3 month outlook
    • Project path alternatives / improvements
  • Proactively manage program scope changes, identify potential risks, propose/create contingency plans

Requirements:

  • 5+ years of experience of integrated optical project and program management experience
  • Should have broad experience in platform and optical component development with experience/exposure to silicon development, silicon photonics development, package development, PCB development, platform hardware development, and software/firmware development
  • Must have a track record of successfully delivering a product to the market on time and to customer expectations
  • Must possess good planning skills as well as strong oral and written communication skills. 
  • Ability to communicate in Mandarin is a plus
  • Ability to assess and escalate issues with the right risk level and priorities
  • Customer focused

Educational Requirements:

  • Minimum B.Sc. Engineering or CS, Masters strongly preferred,
  • Program management certifications are a plus

Other Skills/Experience:

Email your resume to careers@rockleyphotonics.com and reference RP1129.

All candidates must be able to meet and work under Export Control requirements.

 

Senior Program Manager - TRX

This role is responsible for driving, following up and managing the Rockley Photonics TRX Program(s) Plans, resources and schedules starting with the 100G TRX product family.

Responsibilities:

  • Working with Integration Leads and teams to effectively progress the product design/cost/schedule targets
  • Create program plan (Activities, schedule, cost, resources, partners) while working with Integration Leads to define major milestones
    • Ability to understand big ticket items in optical Integration Lead's design
    • Understand design process dependencies between all functional areas
    • Agile mindset: Ability to highlight alternatives in case of unexpected hurdles in the design process
    • Resourceful: Well connected withing optical industry, established contacts to major suppliers and OEMs
  • Develop TRX product design flow together with Integration Leads
  • Responsible for tracking the overall schedule while maintaining the tops-down and bottoms-up views.
    • Facilitate scheduling conflicts resolution with Integration Leads and escalate to management when appropriate
    • Maintain schedule alignment and dependencies across all TRX projects
    • Anticipate possible shortages based on project risks
  • Responsible for tracking the TRX resource planning
    • Anticiptae, highlight and track gaps between available and planned resources
    • Working with Integration Leads and HR to drive closure of hiring plan
    • Assessing impact of shortages and redirection of resources on program plan
  • Responsible for tracking the overall TRX cost and tracking the development budgets, product costs
    • Identify synergies between projects
    • Make or buy analyses
  • Prepare status reports for Integration Lead 
    • Plan vs. current status
    • 3 month outlook
    • Project path alternatives / improvements
  • Proactively manage program scope changes, identify potential risks, propose create contingency plans

Requirements:

  • 5+ years of experience of optical TRX project and program management
  • Should have broad experience in platform and optical component development with experience/exposure to silicon development, silicon photonics development, package development, PCB development, platform hardware development, and software/firmware development
  • Must have a track record of successfully delivering a product to the market on time and to customer expectations
  • Possess good planning skills as well as strong oral and written communication skills. 
  • Ability to communicate in Mandarin
  • Ability to assess and escalate issues with the right risk level and priorities
  • Customer focused

Educational Requirements:

  • Minimum B.Sc. Engineering or CS, Masters strongly preferred

Email your resume to careers@rockleyphotonics.com and reference RP1128.

All candidates must be able to meet and work under Export Control requirements.